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More than two decades of collaboration on sensors for automotive x-by-wire systems culminate in significant milestone.
April 28, 2023
By: DAVID SAVASTANO
Editor, Ink World Magazine
onsemi announced that the company has shipped its one billionth Inductive Sensor Interface Integrated Circuit (IC) to HELLA, an international automotive supplier operating under the umbrella brand FORVIA. The IC designed by onsemi is being used in HELLA’s Contactless Inductive Position Sensor (CIPOS) technology for automotive x-by-wire systems. Throughout their 25-year collaboration, the companies developed innovative design methods that reduced the size of both the HELLA module and the onsem...
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